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Wing Lam

Wing Lam

Wing Lam started his career at IHS Markit in 2005. In 2006 as part of the Teardown business expansion, Wing established the team in Shenzhen, China and has been instrumental in growing and developing the team who now perform 80% of the teardown process on about 160 devices yearly. As an associate director in the teardown and price benchmarking team, Wing manages the Shenzhen team, and provides technical and pricing analysis on electronic hardware ranging from mobile phones to automotive control modules.

Wing graduated magna cum laude from University of California, San Diego with a Bachelor of Science in Electrical Engineering.


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IHS Teardown Methodology - Producing the Best "Should Cost" Estimate

A "Teardown" is a dis-assembly of a device to gain knowledge of the discrete parts. IHS Markit goes further to estimate the "should cost" of components to the manufacture for mature products. The purpose of IHS Markit teardowns is to support customer's quests to understand cost at a component, feature, function, and total device level.

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Mobile, Consumer & Connected Devices Teardowns & Cost Benchmarking Healthcare Technology
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